发明名称 HIGH-FREQUENCY CIRCUIT MULTILAYER BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a high-frequency circuit multilayer board which is restrained from increasing in size and capable of preventing a high-frequency amplification circuit from decreasing its output power. <P>SOLUTION: The high-frequency circuit multilayer board is equipped with a dielectric board composed by laminating first to fourth non-magnetic dielectric layers 51 to 54; a first ground electrode 62 interposed between the first and second non-magnetic dielectric layer, 51 and 52; a second ground electrode 63 which is interposed between the third and fourth ground dielectric layer 53 and 54 and located below the first ground electrode 62; a magnetic material region 90 formed in the second and third non-magnetic dielectric layer 52 and 53 in a region where the first and second ground electrode 62 and 63 are confronted with each other; power supply wiring 64 which is provided between the second and third non-magnetic dielectric layer 52 and 53 through the magnetic material region 90; and connecting conductors 61 which electrically connect wiring conductors 60 provided on surfaces of the dielectric layers 51 to 54 except the magnetic material region 90 and the wiring conductors 60 arranged in a vertical direction to each other. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003282785(A) 申请公布日期 2003.10.03
申请号 JP20020086804 申请日期 2002.03.26
申请人 KYOCERA CORP 发明人 KUBO TAKANORI
分类号 H05K3/46;H01L23/12;H01P3/08 主分类号 H05K3/46
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