发明名称 PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND SURFACE ROUGHENED COPPER PLATE
摘要 [PROBLEMS] To provide a method for roughening the both sides of a copper plate by forming minute nodular protrusions on the both sides of the copper plate in which progress of deterioration of electrolytic copper plating liquid is retarded. [MEANS FOR SOLVING PROBLEMS] Electrodes (3, 3) of the same polarity are arranged oppositely in electrolytic copper plating liquid (2) and a copper plate (4) is arranged between. At first, anodization for generating fine copper particles on the both sides of the copper plate (4) by electrolysis using the copper plate (4) as a positive electrode and the electrodes (3, 3) as a negative electrode is carried out. Thereafter, cathode processing for fixing the fine copper particles to the surface of the copper plate (4) by electrolytic plating using the copper plate (4) as a negative electrode and the electrodes (3, 3) as a positive electrode is carried out. Minute nodular protrusions are formed by performing anodization and cathode processing one cycle or more.
申请公布号 WO2008108341(A1) 申请公布日期 2008.09.12
申请号 WO2008JP53786 申请日期 2008.03.03
申请人 THE FURUKAWA ELECTRIC CO., LTD.;FURUKAWA AUTOMOTIVE SYSTEMS INC.;WATANABE, HAJIME;ISHIHAMA, SADAO;YAMAMOTO, KIYOTERU;IMAI, TAKAHIRO;OYOSHI, TOSHIHIRO 发明人 WATANABE, HAJIME;ISHIHAMA, SADAO;YAMAMOTO, KIYOTERU;IMAI, TAKAHIRO;OYOSHI, TOSHIHIRO
分类号 C25D5/48;C25D17/00;C25D21/12;H05K1/05 主分类号 C25D5/48
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