| 摘要 |
There is provided a semiconductor package of a chip size corresponding to a semiconductor element with a narrow electrode pad pitch. The semiconductor package (1) has a semiconductor substrate (10) having a first main surface (10A) and a second main surface (10B), a circuit element formed on the first main surface (10A), a plurality of electrode pads (20) connected to the circuit element provided on the first main surface (10A), a plurality of external connection terminals (70) provided on the second main surface (10B), one or more through holes (51) reaching the second main surface (10B) from the first main surface (10A), and a plurality of through wirings (60) each connecting a plurality of the electrode pads (20) with a plurality of the external connection terminals (70) through each of one or more through holes (51). |
