DUPLEX POLISHING APPARATUS AND DUPLEX POLISHING METHOD FOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a duplex polishing apparatus and a duplex polishing method for wafer, by which the wafer can be accurately and stably polished without deteriorating the shape of the wafer because the shape of the wafer can be controlled by deforming a surface plate with excellent responsibility.

SOLUTION: The duplex polishing apparatus includes at least a carrier plate having wafer carrying bores, an upper surface plate and a lower surface plate having a grinding cloth stuck thereon, and a slurry supplying means. The duplex polishing apparatus simultaneously polishes both front and back surfaces of the wafers by holding the wafers in the wafer holding bores and moving the carrier plate between the upper surface plate and the lower surface plate while supplying slurry. The duplex polishing apparatus is characterized in that the pitch circle diameter of the circle connecting the load fulcrums of the upper surface plate coincides with the pitch circle diameter of the circle connecting the centers of the carrying bores of the carrier plate.

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