Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components

摘要

A paste material for filling a through-hole for improved adhesion and hermeticity in glass substrates. In some embodiments, the paste material comprises a metal, a glass frit composition, a solvent, a resin, a conductive or non-conductive inert additive, or mixtures thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.

主权项

1. A paste material for filling a through-hole, said paste material comprising:
a. a Cu powder having a particle size ranging from 2 to 10 microns for D50; b. a glass frit composition comprising oxides and compounds of Pb, wherein a glass frit particle size of the glass frit composition ranges from 6 to 24 microns for D50; c. an ester alcohol solvent; d. an ethyl cellulose resin; and e. a non-conductive Al2O3 additive and a conductive molybdenum additive;wherein the paste material has an improved adhesion to the through-hole, wherein the solvent maintains a paste consistency of the paste material when filling the through-hole; and wherein the through-hole filled with the paste material is hermetic.