发明名称 Semiconductor arrangement comprising transmission line surrounded by magnetic layer
摘要 A semiconductor arrangement is provided. The semiconductor arrangement includes a first dielectric layer surrounding a first transmission line and a magnetic layer surrounding the first dielectric layer. The magnetic layer increases the inductance of the transmission line. The semiconductor arrangement having the magnetic layer surrounding the first transmission line has increased impedance, which promotes current flow through the transmission line, without having increased resistance as compared to a semiconductor arrangement that does not have a magnetic layer. Increased resistance requires increased power, which results in a shorter semiconductor arrangement life span than the semiconductor arrangement without the increased resistance.
申请公布号 US9379069(B2) 申请公布日期 2016.06.28
申请号 US201414261473 申请日期 2014.04.25
申请人 Taiwan Semiconductor Manufacturing Company Limited 发明人 Chen Huan-Neng;Jin Jun-De;Chen Shuo-Mao;Jou Chewn-Pu
分类号 H01L29/40;H01L23/66;H01L21/768;H01L23/522 主分类号 H01L29/40
代理机构 Cooper Legal Group, LLC 代理人 Cooper Legal Group, LLC
主权项 1. A semiconductor arrangement comprising: a first transmission line having a first thickness and a first width, wherein: the first thickness is different than the first width,the first thickness is measured between a bottom wall of the first transmission line and a top wall of the first transmission line, andthe first width is measured between a first sidewall of the first transmission line and a second sidewall of the first transmission line; a first dielectric layer surrounding the first transmission line and in contact with the top wall, the bottom wall, the first sidewall and the second sidewall of the first transmission line; a magnetic layer surrounding the first dielectric layer; and a second dielectric layer surrounding the magnetic layer and in contact with a top wall of the magnetic layer.
地址 Hsin-Chu TW