| 发明名称 |
LED DEVICE |
| 摘要 |
Provided is an LED device presenting minimal risk of bottom-surface contamination even when foreign substances such as liquids adhere thereto. The LED device has an LED die, a submount substrate on the surface of which the LED die is mounted, a frame-shaped electrode disposed along the outer circumferential part of the bottom surface of the submount substrate, and an inner-side electrode surrounded by the frame-shaped electrode and connected to the electrode of the LED die. In the LED device, the frame-shaped electrode is disposed along the entire outer circumferential part of the bottom surface. In an LED device, the bottom surface is rectangular, and the frame-shaped electrode is disposed along three sides of the bottom surface. |
| 申请公布号 |
US2016197253(A1) |
申请公布日期 |
2016.07.07 |
| 申请号 |
US201414901471 |
申请日期 |
2014.06.23 |
| 申请人 |
CITIZEN HOLDINGS CO., LTD. ;CITIZEN ELECTRONICS CO., LTD. |
发明人 |
Miyashita Isao;Kumasaka Taku;Watanabe Keita;Tsuchiya Kosuke |
| 分类号 |
H01L33/62;H01L33/48;H01L27/15;H01L33/38 |
主分类号 |
H01L33/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An LED device comprising:
an LED die; a submount substrate on the surface of which the LED die is mounted; a frame-shaped electrode that is arranged along the periphery of the bottom of the submount substrate; and an inside electrode that is surrounded by the frame-shaped electrode and which is connected to the electrode of the LED die. |
| 地址 |
Nishitokyo-shi, Tokyo JP |
