LEAD FRAME FOR SEMICONDUCTIVE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a lead frame for manufacturing a semiconductor package and a method for manufacturing the same capable of improving a strip type lead frame structure having a plurality of individual units, and easily preventing generation of a burr in a case of cutting the semiconductor package in half for a package test after chip attachment and block molding. The lead frame for manufacturing the semiconductor package and the method for manufacturing the same are provided to improve a structure frame including the lead frame to a half etched structure; and minimize a touched size between a blade and the structure frame in a starting point of the blade, thereby easily cutting a support bar connecting each lead of each unit in half, and preventing the generation of the burr.