MULTI-LAYERED LED ASSEMBLY

摘要

The present invention provides a multi-layered light emitting diode (LED) assembly comprising: a first substrate having a plurality of LED devices disposed on one surface; and one or more of second substrates arranged under the first substrate in parallel. The second substrates have a plurality of LED devices disposed thereon and multiple holes to pass light emitted from the LED devices disposed on the first substrate. According to the present invention, in the multi-layered LED assembly, the LED devices being heating source are discretely arranged on multiple layers, so cooling load may be reduced when compared to an existing LED assembly on which the LED devices are intensively disposed on one substrate to obtain high brightness. Moreover, reduction of the cooling load allows the LED devices to be densely packed for high brightness.