| 发明名称 | Semiconductor device connected by anisotropic conductive adhesive film | ||
| 摘要 | A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content. | ||
| 申请公布号 | US9437346(B2) | 申请公布日期 | 2016.09.06 |
| 申请号 | US201314049243 | 申请日期 | 2013.10.09 |
| 申请人 | CHEIL INDUSTRIES, INC. | 发明人 | Shin Kyoung Hun;Park Do Hyun;Seo Hyun Joo;Shin Young Ju;Kim Kyu Bong;Lim Woo Jun |
| 分类号 | H01B1/22;H01L23/60;H01L23/00 | 主分类号 | H01B1/22 |
| 代理机构 | Lee & Morse, P.C. | 代理人 | Lee & Morse, P.C. |
| 主权项 | 1. A display device connected using an anisotropic conductive adhesive film, the anisotropic conductive adhesive film comprising: a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the film in an amount of 1 wt % to 25 wt %, based on the total weight of the film in terms of solid content, and wherein the anisotropic conductive adhesive film has a tensile strength before curing of 5 kgf/cm2 or more. | ||
| 地址 | Gumi-si, Kyeongsangbuk-do KR | ||