| 摘要 |
A fixed probe board to be used for testing semiconductor wafer chips. The probe board comprises a probe support base having four mutually tapered probe support surfaces, and a multiplicity of probes secured on the probe support surfaces with their forward contact tips lying in a common contacting plane. The four probe support surfaces are joined together along lines corresponding to extensions of two diagonal lines of a semiconductor wafer chip to be tested. The inner circumference of each probe support surface is arcuate so as to be approximately equally distanced from the corresponding side of the wafer chip. The probe surfaces have the same acute angle relative to their common contacting plane.
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