发明名称 |
Method of removing deposits of tin, lead or tin/lead alloys from copper substrates and compositions for use therein |
摘要 |
A composition for removing a layer of tin, lead or tin/lead alloy from a copper substrate such as a printed circuit board comprises an aqueous solution of nitric acid and ferric acid and also contains anthranilic acid to inhibit the degree of attack on the copper substrate. A surfactant, such as a mixture of cocoamine and an ethoxylated fatty alcohol or a mixture of a phosphate ester and an ethylene oxide/propylene oxide copolymer, may also be present to improve the brightness of the remaining copper.
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申请公布号 |
US4964920(A) |
申请公布日期 |
1990.10.23 |
申请号 |
US19890451054 |
申请日期 |
1989.12.15 |
申请人 |
IMASA LIMITED |
发明人 |
JACKSON, BRIAN;BARNETT, GARY |
分类号 |
C22B15/14;C22B7/00;C23F1/44;H05K3/06 |
主分类号 |
C22B15/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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