| 摘要 |
<p>A method and apparatus is disclosed for handling semiconductors wafers (10) used for the production of integrated circuit structures which permits moving the waver (10) from one processing station to another without direct handling of the wafer (10) and which also permits equal processing of both the top and bottom surfaces of the wafer (10). A wafer (10) retaining ring (20) is disclosed having means (24) for engaging the retaining ring (10) to transfer the wafer (10) and the retaining ring (20) from one processing station to another to perform a plurality of processing steps on one or both surfaces of the wafer without direct handling of the wafer (10). The retaining ring (20) is also provided with means (30) for engaging the end edges of the wafer leaving both the top and bottom surfaces of the wafer equally exposed for processing. The retaining ring (20) has an inner diameter sufficiently large with respect to the outer diameter of the wafer so as to not interfere with processing by shadowing either side of the wafer (10).</p> |
