Method and means for bonding of lead wires for an integrated circuit device.

摘要

Bonding of lead wires (14) between electrical contact points (15) of an integrated circuit and the conductive elements of a flexible tape-like structure (10) on which the integrated circuit (13) is seated is accomplished by means of a vacuum chuck (18) having distributed recesses through which a partial vacuum is applied to the flexible structure. Support elements are provided with the vacuum recesses to ensure that the flexible tape-like structure presents a planar orientation to a bonding tool. The tape-like structure is maintained in a substantially rigid position during the bonding process enabling precision bonding of lead wires.