发明名称 Method for the formation of a silicon oxide film
摘要 <p>Disclosed is a method for the formation of a thick silicon oxide film on the surface of a substrate. The method comprises forming a hydrogen silsesquioxane resin film on the surface of a substrate followed by converting the hydrogen silsesquioxane resin into silicon oxide ceramic by heating the resin film-bearing substrate in a mixed gas atmosphere of above 0 volume% up to 20 volume% oxygen and 80 volume% up to, but not including, 100 volume% inert gas until the content of silicon-bonded hydrogen in the silicon oxide product has reached </= 80% of the content of silicon-bonded hydrogen in the hydrogen silsesquioxane resin.</p>
申请公布号 EP0606580(B1) 申请公布日期 1996.01.03
申请号 EP19930119493 申请日期 1993.12.03
申请人 DOW CORNING TORAY SILICONE COMPANY, LIMITED 发明人 MINE, KATSUTOSHI, C/O DOW CORNING TORAY SILICONE;NAKAMURA, TAKASHI, C/O DOW CORNING TORAY SILICONE;SASAKI, MOTOSHI, C/O DOW CORNING TORAY SILICONE
分类号 C03C17/23;C04B41/50;C04B41/87;C09D183/05;C23C18/12;H01L21/312;H01L21/314;H01L21/316;(IPC1-7):C04B41/50 主分类号 C03C17/23
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