| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light-emitting element, such as a plastic embedded LED suitably applicable to an image display device, capable of efficiently completely removing foreign matters generated at the time of peeling an LED, without damaging the LED or the pad electrode of the LED. <P>SOLUTION: This method for manufacturing a semiconductor light-emitting element comprises a step for forming a semiconductor layer which is an LED 2 on a sapphire substrate, a process for patterning the semiconductor layer, a process for coating an insulating layer 3 on the semiconductor layer, a process for peeling the sapphire substrate 1 and the semiconductor layer at the boundary and a process for removing foreign matters (carbon accuser substances) 19, generated in the periphery of the semiconductor layer in the peeling process by irradiating a long-wavelength laser beam 23. <P>COPYRIGHT: (C)2004,JPO |
