| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which can perform assembly high in yield rate by stably mounting an elastic structure on a wiring board with high accuracy by the adoption of surface mounting structure, and stabilizing the bonding process of a semiconductor chip. SOLUTION: This is a ball grid array type of semiconductor package, and this is composed of a semiconductor chip 1 where a bonding pad is made, an elastomer 2 which is bonded to the semiconductor chip 1, a flexible wiring board 3 which is bonded to the elastomer 2 and in which wiring whose lead is connected to the bonding pad of the semiconductor pad 1 is made, a solder resist 4 which is made on the main surface of the flexible wiring board 3, and a bump 5 which is connected to the bump land of the wiring. This is the so- called surface wiring structure where the elastomer 2 is bonded to the semiconductor chip 1 side of the tape 9 of the flexible wiring board 3, and besides the solder resist 4 is made on the solder bump 5 side of the wiring 10. |
