发明名称 |
Apparatus for clamping a planar substrate |
摘要 |
The disclosure relates to an apparatus for electrostatically adhering grains to a planar substrate comprising: a. an electrostatic chuck having a collection surface with at least one grain collection zone for, when the planar substrate is layered on the collection surface, electrostatically directing charged grains to a corresponding surface on the planar substrate; and b. a pattern of holes through the electrostatic chuck allowing a source of low pressure to act through the electrostatic chuck to adhere the planar substrate.
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申请公布号 |
US2003196599(A1) |
申请公布日期 |
2003.10.23 |
申请号 |
US20030423785 |
申请日期 |
2003.04.25 |
申请人 |
DELSYS PHARMACEUTICAL CORPORATION |
发明人 |
SUN HOI CHEONG STEVE;BRYCKI BOGDAN |
分类号 |
B05D1/06;A61K9/20;B01J19/00;B05B5/03;B05B5/08;H01L21/683;H02N13/00;(IPC1-7):B05C5/02 |
主分类号 |
B05D1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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