发明名称 |
A DUAL STACKED METAL-INSULATOR-METAL CAPACITOR AND METHOD FOR MAKING SAME |
摘要 |
A multilayer semiconductor device and method of making a dual stacked metal-insulator-metal (MIM) capacitor of a multilayer semiconductor device, which includes a bottom metal layer including a capacitor plate and a wiring level, an intermediate metal layer forming at least a capacitor plate, and a top metal layer including a capacitor plate and a wiring level, a via that electrically contacts the intermediate metal layer, and at least two electrically connected vias that contact the bottom metal layer and the top metal layer. A dielectric etchstop layer may be formed above the dual stacked MIM capacitor.
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申请公布号 |
US2003197215(A1) |
申请公布日期 |
2003.10.23 |
申请号 |
US20030248658 |
申请日期 |
2003.02.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COOLBAUGH DOUGLAS DUANE;JOSEPH ALVIN JOSE;MALINOWSKI JOHN CHESTER;RAMACHANDRAN VIDHYA |
分类号 |
H01L21/02;H01L21/311;H01L21/768;(IPC1-7):H01L27/108 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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