发明名称 METHOD AND APPARATUS FOR COMPACT MOLDING POROUS CHIP BODY FOR CAPACITOR ELEMENT IN SOLID ELECTROLYTIC CAPACITOR
摘要 PROBLEM TO BE SOLVED: To increase the strength of the root part of an anode wire by providing projecting parts on the parts of tip surfaces of both molding dies in contact with an upper molding die when the both molding dies inserted in the right and left sides of a molding groove are advanced to compact metal powder filled in the groove to mold a porous chip body. SOLUTION: Projecting parts F2, G2 projecting forward by a height S are provided on the parts of tip surfaces F1, G1 of both molding die F, G in contact with an upper molding die H. Valve action metal powder C is filled into a molding groove E1 of a lower molding die E in the state wherein the molding dies F, G are inserted into right and left sides of the molding groove E1 respectively, and the upper molding die holding an anode wire 1, so that the wire 1 projects from the lower surface thereof to the upper surface of the lower molding die, is subjected to die registering for sealing the molding groove E1. Then, the metal powder C can be compacted and molded in the state wherein the anode wire 1 is buried in a chip body 2 by advancing both molding dies F, G toward the anode wire.
申请公布号 JPH10163074(A) 申请公布日期 1998.06.19
申请号 JP19960322972 申请日期 1996.12.03
申请人 ROHM CO LTD 发明人 SHIBATO HIROYUKI
分类号 H01G9/052;H01G13/00 主分类号 H01G9/052
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