SEMICONDUCTOR LEAD FRAME AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame with good heat transfer at low cost, along with a semiconductor device with the lead. SOLUTION: A circuital element 2 is put on one face of an end part of opposite leads in a lead frame 5 with the insulating bonding layer 4 in between in a way that the circuital face of the element 2 is put near the insulating bonding layer 4. Then, the circuit formed face of the element 2 and the other face of the lead frame 5 outside the insulating bonding layer 4 are wire-bonded with a bonding wire 6.