发明名称 ABRASIVE GRAIN BURYING DEVICE AND METHOD, AND POLISHING DEVICE USING IT
摘要 <P>PROBLEM TO BE SOLVED: To bury and fix abrasive grains into a surface plate at a high density in a short time. <P>SOLUTION: The surface plate 1 is rotated by a motor (not shown), and working fluid 7 containing abrasive grains is dripped onto a metal layer 2 disposed on the surface plate 1, thereby forming a liquid layer of free abrasive grains. A movable member 4 is faced to a surface of the metal layer 2 and is stored in a fixing member 3, and is repeatedly moved vertically by the motor 6 with respect to the surface of the metal layer 2 as shown in the arrow A-B direction. When the movable member 4 moves in the arrow direction to increase the interval between the movable member 4 and the metal layer 2, a liquid layer having uniformly dispersed free abrasive grains intrudes into the gap between them. When the movable member 4 moves in the arrow B direction to be pressed to the metal layer 2, the interval becomes narrow, and the surface of the movable member 4 causes the free abrasive grains to be buried into the metal layer 2, and the free abrasive grains are fixed. By the vertical movement of the movable member 4, uniform fixed abrasive grains can be obtained at a high density in a short time. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003311605(A) 申请公布日期 2003.11.05
申请号 JP20020118158 申请日期 2002.04.19
申请人 HITACHI LTD 发明人 HOTTA HIDEJI;TAMURA TOSHIO;FURUSAWA KENJI
分类号 B24B37/00;B24B37/12;G11B5/187 主分类号 B24B37/00
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