| 摘要 |
<p>A method for forming low-impedance high density deposited-on-laminate (D/L) structures (10) having reduced stress features reducing metallization present on the laminate printed circuit board (12). In this manner, reduced is the force per unit area exerted on the dielectric material (30) disposed adjacent to the laminate material (16) which is typically present during thermal cycling of the structure.</p> |
