METHOD FOR MANUFACTURING CONTACT OF MULTI-LAYERED WIRING

摘要

PURPOSE: A method for manufacturing a contact of a multi-layered wiring is provided to reduce resistance by improving a profile of an interconnection layer near a contact. CONSTITUTION: An insulating layer is evaporated on a lower first conductive layer. The insulating layer is patterned to form a contact hole exposing a part of the first conductive layer. A barrier metal layer is formed on the entire structure having the contact hole. A metal layer of a plug and a buffer insulating layer are consecutively evaporated. A photoresist layer is applied on the buffer insulating layer. The photoresist layer is patterned to form a photoresist layer pattern on the contact hole and buffer insulating layer. The buffer insulating layer is isotropically dry-etched by using the photoresist layer pattern as a mask to form a buffer insulating layer pattern of a taper shape. The buffer insulating layer pattern and the metal layer for a plug are etched-back to form a plug of which the surface is in parallel with the surface of the barrier metal layer.