| 发明名称 |
METHOD FOR TREATING ELECTROLESS COPPER PLATING WASTE LIQUID AND TREATMENT AGENT USED THEREIN |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for treating an electroless copper plating waste liquid, capable of efficiently flocculating and sedimenting copper from the electroless copper plating waste liquid. SOLUTION: In the method for treating the electroless copper plating waste liquid to remove copper contained in the waste liquid, the pH of the waste liquid is held to pH 11 or more in the presence of calcium ions and iron ions. |
| 申请公布号 |
JP2001347277(A) |
申请公布日期 |
2001.12.18 |
| 申请号 |
JP20000169480 |
申请日期 |
2000.06.06 |
| 申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY;TATSUMI KENJI;WADA SHINJI;MITSUBISHI CORP |
发明人 |
TATSUMI KENJI;WADA SHINJI;YUGAWA YASUHIRO |
| 分类号 |
C02F1/62;C02F1/52;C02F1/56;C23C18/16 |
主分类号 |
C02F1/62 |
| 代理机构 |
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