Vorrichtung und Verfahren zum Bestücken eines Leadframes mit integrierten Schaltungen

摘要

The assembly device is used to attach at least one integrated circuit (IC) (2) to a leadframe (1) using a guide unit for feeding the leadframe adjacent one side of a foil (4) to which an IC is attached, supported in a carrier. An ejector (6) acts on the opposite side of the foil, for transferring each of the ICs from the foil to the leadframe. A setting device can move the carrier for the foil relative to the ejector, with a second setting device moving the guide unit relative to the ejector. The units set the carrier to respective positions relative to the ejector. A third unit modifies the spacing between the carrier and the guide unit. A detector specifies the position of the ICs on the stressed foil and/or the leadframe position in the guide unit. The ejector is coupled to the setting units and is also coupled to a camera.