| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a soldering structure between metals that can reduce the occurrence of solder voids without increasing the number of components, lowering the component mounting positional accuracy on a substrate, and the like, and at the same time, can secure high connection reliability. <P>SOLUTION: The connecting surface 11 of the electrode 12 of a chip resistor 10 is formed by forming a secondary plated layer 17 on the surfaces of primary plated electrode layers 15 and 16 and a ternary plated layer 18 on the surface of the secondary plated layer 17. On the surface of a plated Sn layer formed as the ternary plated layer 18, a plurality of solder void discharging recessed grooves 19 is formed along the longitudinal direction of the chip resistor 10 (the lateral direction in the figure) through post treatment performed by using a brush etc. The recessed grooves 19 become passages through which generated solder voids 30 are discharged to the outside as shown by the arrows in the figure and make the solder voids 30 easily escapable. In addition, the connecting surface 21 of a lead frame 20 is formed coarsely. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
