FABRICATED ADHESIVE MICROSTRUCTURES FOR MAKING AN ELECTRICAL CONNECTION

摘要

An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.