METHOD FOR SELECTIVELY PRODUCING FILM LAMINATES FOR PACKAGING AND FOR INSULATING UNPACKAGED ELECTRONIC COMPONENTS AND FUNCTIONAL PATTERNS AND CORRESPONDING DEVICE

摘要

A method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device. The present invention relates to a method for coating surface regions (2) of functional patterns (5) arranged on a substrate (4) and/or of surface regions (2) of semiconductor chips (6) arranged on the substrate (4). An insulation is to be effectively adapted in its properties to different requirements of functional patterns (5) and/or electronic components (6). Film regions (1) are laminated on surface regions (2) in such a way that the properties of the plastics material of the film regions (1) are adapted to the function of the film. This adaptation is individual and selective. Various films (3) are used. The method is suitable in particular for coating or packaging electronic components (6) or active and passive devices.