发明名称 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same
摘要 An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a multi-phase coating formed on the tin layer to impede tin whisker growth. The multi-phase coating comprises a polymer matrix having pores dispersed therethrough, with the pores constituting at least 30% by volume of the coating. To form the multi-phase coating, the tin plating or finish is covered with a coating comprising a polymer matrix having a second material mixed therein. The second material is subsequently removed from the polymer matrix to produce a coating having pores in the matrix where the second material was disposed before being removed.
申请公布号 US2007287023(A1) 申请公布日期 2007.12.13
申请号 US20060515116 申请日期 2006.08.31
申请人 HONEYWELL INTERNATIONAL, INC. 发明人 JACKSON MERRILL M.;HUMPHREY DAVID
分类号 B21D39/00 主分类号 B21D39/00
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