| 摘要 |
A one-chip type RF(Radio Frequency) integration module is provided to realize each circuit element which constitutes an RF end as one package element, and to dispose/design a chalk coil equipped in a power amplification module in efficient structure, thereby minimizing a mounting area on a substrate. A chalk coil(A) of a power amplification module consists of the first inductor unit formed as a metal line(d2), and the second inductor unit equipped as an inductor element connected with the first inductor unit. The first inductor unit is composed of the first metal line(d2) and the second metal line(e) isolated from the first metal line(d2). The second inductor unit electrically connects the first metal line(d2) with the second metal line(e).
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