| 摘要 |
A radio frequency accumulated module of a one chip type is provided to reduce a size of a substrate by improving a structure of a choke coil of a power amplifying stage. A radio frequency accumulated module of a one chip type includes a front end module, a power amplifying module, a transceiver module, and a matching circuit module. The front end module divides multi-band signals into transmitting signals and receiving signals to filter the divided signals. The power amplifying module amplifies receiving signals from the transceiver module to transmit the amplified receiving signals to the front end module. The transceiver module converts baseband signals and RF signals into each other. The matching circuit module matches impedance between the transceiver module and the front end module. A choke coil(A) of the power amplifying module has a first inductor unit and a second inductor unit. The first inductor unit is composed of metal lines. The second inductor unit is a bonding element connected to the first inductor unit.
|
