| 发明名称 |
Encapsulation for electroluminescent devices |
| 摘要 |
An electroluminescent device having a protection layer in the cap bonding region to which the cap is bonded. The protection layer can be formed from photosensitive or non-photosensitive materials. The protection layer protects the layers below from being damage during removal of polymer materials.
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| 申请公布号 |
US2003209979(A1) |
申请公布日期 |
2003.11.13 |
| 申请号 |
US20020142208 |
申请日期 |
2002.05.07 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
GUENTHER EWALD;LIM HOOI BIN;CHONG SHI CHAI;LACEY DAVID |
| 分类号 |
H01L51/52;(IPC1-7):H05B33/00 |
主分类号 |
H01L51/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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