MOUNTING SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

A mounting substrate and a manufacturing method thereof are provided to simplify process by forming a bonding pad reclaimed in an insulating layer. A housing substrate comprises an insulating layer(200), a bonding pad, and a circuit pattern(201). In the single-side of the substrate, a chip is mounted. The bonding pad is reclaimed to the single-side of the insulating layer corresponding to a location in which the chip is mounted. The circuit pattern is electrically connected to the bonding pad. The surface of the bonding pad is depressed from the surface of the insulating layer with a certain height. The bonding pad comprises a land reclaimed to the single-side of the insulating layer. The surface of the land is depressed from the surface of the insulating layer with a certain height.