| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition providing a cured product having a low modulus and excellent adhesiveness, and to provide an adhesive film having the adhesive layer. SOLUTION: The adhesive composition comprises (A) 100 pts.mass of a polyimide resin having a diorganopolysiloxane residue having a vinyl group and a phenyl group bound to silicon atoms, (B) 5-200 pts.mass of an epoxy resin, and (C) an epoxy resin-curing catalyst. The adhesive film is obtained by using the adhesive composition. COPYRIGHT: (C)2009,JPO&INPIT
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