TAPE FOR PROCESSING WAFER

摘要

A tape for processing wafer is provided with an adhesive tape (10) having a base material sheet (11) and an adhesive layer (12).The tape is also provided with an adhesive film (13) arranged on the adhesive layer (12). The tape is used for cutting the adhesive film (13) corresponding to each chip by expanding the adhesive tape (10), under a low temperature within a range of -15°C to 5°C. Peeling force of the adhesive tape (10) from the adhesive film (13) obtained in peeling test at 0°C±2°C is 0.2N/25mm or more.