发明名称 LEAD FRAME AND METHOD OF MANUFACTURING LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a lead frame in which deformation of a connecting bar can be prevented while suppressing occurrence of a bur during sewing processing, and to provide a method of manufacturing the same.SOLUTION: A lead frame 10 comprises a plurality of lead frame elements 14 including a die pad 15, and a plurality of lead portions 16 provided around the die pad 15. Between adjoining lead frame elements 14, a pair of corresponding leads 16 are connected via a connecting bar 17. The connecting bar 17 extends perpendicularly to a longitudinal direction of the lead portions 16, and has a plurality of lead connecting portions 18 located between the pair of corresponding lead portions 16, and a plurality of reinforcing portions 19 located between the lead connecting portions 18. The reinforcing portion 19 of the connecting bar 17 has a trapezoidal cross section of the same thickness as that of the lead portions 16.SELECTED DRAWING: Figure 2
申请公布号 JP2016105524(A) 申请公布日期 2016.06.09
申请号 JP20160047114 申请日期 2016.03.10
申请人 DAINIPPON PRINTING CO LTD 发明人 TOMITA KOJI;HARIGAE YOJI;YAZAKI MASAKI
分类号 H01L23/50 主分类号 H01L23/50
代理机构 代理人
主权项
地址