Sensor device and method for manufacture

摘要

A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.

主权项

1. A method of manufacturing a sensor device, the method comprising:
providing a ceramic carrier substrate; and connecting a ceramic component in the form of a chip to the carrier substrate in a mechanically fixed manner using an electrically conductive screen printing paste that can be burnt in, the connecting the ceramic component to the carrier substrate comprising:
applying the screen printing paste to the ceramic carrier substrate thereby forming at least two conductor tracks on the carrier substrate;arranging the ceramic component on the carrier substrate such that the ceramic component electrically contacts and connects the screen printing paste via at least two connection regions; andperforming a burning-in process so that the screen printing paste is burnt into the ceramic carrier substrate and the ceramic component, wherein the ceramic component and the screen printing paste enter a mechanically stable connection during the burning process.