Method for producing package, method for producing electronic device, and electronic device

摘要

A method for producing a package includes preparing a base substrate provided with a low-melting glass and a lid, defoaming the low-melting glass by heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere, and joining the base substrate and the lid to each other by superimposing the base substrate and the lid on each other through the low-melting glass, and then heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere.

主权项

1. An electronic device comprising:
a base substrate; a lid joined to the base substrate and defining an internal space therebetween; and a functional device disposed in the internal space, wherein the lid is formed from a low-melting glass from which gas is removed so that the low-melting glass is in a dense state.