Electric power conversion circuit

摘要

In a three phase inverter device, a smoothing capacitor, a bus bar at a positive electrode side and a bus bar at a negative electrode side are formed on a first surface of the circuit substrate. Electronic components containing a microcomputer, etc., a differential wiring pattern, a single wiring pattern and a current wiring pattern are formed on a second surface of the circuit substrate. A ground pattern is formed in the inside of the circuit substrate in order to separate the electronic components, the differential wiring pattern, the single wiring pattern and the current wiring pattern from the smoothing capacitor, the bus bar at the positive electrode side and the bus bar at the negative electrode side.

主权项

1. An electric power conversion device comprising:
a plurality of switching elements; a control circuit configured to output drive signals to the switching elements to turn on and off the switching elements; a multi-layer substrate comprising a first surface and a second surface and interior layers, and solid pattern being formed in the interior layers; and a smoothing capacitor connected to the switching elements through conductive members, and performing an operation of smoothing a direct current voltage to be supplied to the switching elements, wherein: the conductive members are formed in the multi-layer substrate at the first surface side of the multi-layer substrate, the smoothing capacitor is formed in an area corresponding to the first surface side, at least one of electronic components is formed on the second surface of the multi-layer substrate, which contains the control circuit and wiring patterns connected to the electronic components, on which drive signals to be used for driving the switching elements are transmitted, the solid pattern is formed in the interior layers of the multi-layer substrate to separate the electronic components and the wiring patterns which are formed on the second surface of the multi-layer substrate from the smoothing capacitor and the conductive members, the control circuit comprises a microcomputer capable of generating the drive signals and outputting the generated drive signals to the switching elements, and the electronic components comprises the control circuit and an analogue integrated circuit for performing the operation of the switching elements, the electric power conversion device is an inverter device for converting a direct current voltage outputted from a direct current power source to an alternating current voltage by turning on and off the switching elements, and outputting the alternating current voltage to an electric rotary machine, the electronic components and the wiring patterns are formed on the second surface of the multi-layer substrate, the solid pattern is formed in the multi-layer substrate to separate the electronic components and the wiring patterns from the smoothing capacitor and the conductive members, at least one of a detection signal from a resolver for detecting a rotary angle of the electric rotary machine and a detection signal from a current sensor for detecting a current flowing in the electric rotary machine is transmitted to the microcomputer through the wiring patterns, and the microcomputer generates the drive signals on the basis of the received detection signal from the resolver and the received detection signal from the current sensor, the analogue integrated circuit comprises differential amplifier circuits for converting a differential signal of the detection signal outputted from the resolver to a single end signal, and the wiring patterns comprises:
a first wiring pattern through which the single end signal outputted from the differential amplifier circuit to the microcomputer;a second wiring pattern through which a differential signal of the detection signal outputted from the resolver is transmitted to the differential amplifier circuit,the second wiring pattern is formed on the first surface of the multi-layer substrate, andthe first wiring pattern is formed on the second surface of the multi-layer substrate.