Substrate processing with reduced warpage and/or controlled strain

摘要

Provided are systems and methods for processing the surface of substrates that scan a laser beam at one or more selected orientation angles. The orientation angle or angles may be selected to reduce substrate warpage. When the substrates are semiconductor wafers having microelectronic devices, the orientation angles may be selected to produce controlled strain and to improve electronic performance of the devices.

主权项

1. A method for processing a surface of a substrate, comprising:
(a) mounting the substrate on a moveable stage; (b) generating a photonic beam suitable for processing the substrate surface; (c) adjusting the moveable stage to position the substrate at a first orientation angle relative to the beam; (d) performing a first scanning of the beam translationally over the substrate surface along a first path at the first orientation angle relative to the beam; and (e) following step (d) adjusting the movable stage to position the substrate at a second orientation angle relative to the beam; and (f) following step (e), performing a second scanning of the beam translationally over the substrate surface along a second path at the second orientation angle relative to the beam.