发明名称 |
POLISHING COMPOSITION AND METHOD FOR PRODUCING SAME |
摘要 |
Provided is a polishing composition with which surface defects can be efficiently reduced. This invention provides a polishing composition comprising a water-soluble polymer MC-end. The main chain of the water-soluble polymer MC-end is formed with a non-cationic region as its main structural part and a cationic region located at least at one end of the main chain. The cationic region has at least one cationic group. |
申请公布号 |
US2016215189(A1) |
申请公布日期 |
2016.07.28 |
申请号 |
US201414917734 |
申请日期 |
2014.09.22 |
申请人 |
FUJIMI INCORPORATED |
发明人 |
TSUCHIYA Kohsuke;MORI Yoshio |
分类号 |
C09K3/14;B24B37/04 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
1. A polishing composition comprising a water-soluble polymer MC-end,
the water-soluble polymer MC-end having a main chain formed with a non-cationic region as its main structural part and a cationic region located at least at one end of the main chain, and the cationic region having at least one cationic group. |
地址 |
Kiyosu-shi, Aichi JP |