发明名称 POLISHING COMPOSITION AND METHOD FOR PRODUCING SAME
摘要 Provided is a polishing composition with which surface defects can be efficiently reduced. This invention provides a polishing composition comprising a water-soluble polymer MC-end. The main chain of the water-soluble polymer MC-end is formed with a non-cationic region as its main structural part and a cationic region located at least at one end of the main chain. The cationic region has at least one cationic group.
申请公布号 US2016215189(A1) 申请公布日期 2016.07.28
申请号 US201414917734 申请日期 2014.09.22
申请人 FUJIMI INCORPORATED 发明人 TSUCHIYA Kohsuke;MORI Yoshio
分类号 C09K3/14;B24B37/04 主分类号 C09K3/14
代理机构 代理人
主权项 1. A polishing composition comprising a water-soluble polymer MC-end, the water-soluble polymer MC-end having a main chain formed with a non-cationic region as its main structural part and a cationic region located at least at one end of the main chain, and the cationic region having at least one cationic group.
地址 Kiyosu-shi, Aichi JP