| 发明名称 | Processing method for plate-shaped workpiece | ||
| 摘要 | A method of processing a plate-shaped workpiece includes: a positioning step of mounting the plate-shaped workpiece on a support plate; a joining step of irradiating an outer peripheral portion of the plate-shaped workpiece mounted on the support plate with a laser beam to form a fusion bond region where the plate-shaped workpiece is fusion-bonded to the support plate at the outer peripheral portion of the plate-shaped workpiece, thereby fixing the plate-shaped workpiece onto the support plate; and a processing step of processing the plate-shaped workpiece after the joining step. | ||
| 申请公布号 | US9446479(B2) | 申请公布日期 | 2016.09.20 |
| 申请号 | US201414219669 | 申请日期 | 2014.03.19 |
| 申请人 | Disco Corporation | 发明人 | Wei Frank |
| 分类号 | H01L21/68;H01L21/78;B23K26/21;B23K26/324;B23K26/32;H01L21/683;H01L21/67 | 主分类号 | H01L21/68 |
| 代理机构 | Greer Burns & Crain, Ltd. | 代理人 | Greer Burns & Crain, Ltd. |
| 主权项 | 1. A method of processing a plate-shaped workpiece, comprising: a positioning step of mounting the plate-shaped workpiece on a support plate; a joining step of irradiating an outer peripheral portion of the plate-shaped workpiece mounted on the support plate with a laser beam to form a fusion bond region where the plate-shaped workpiece is fusion-bonded to the support plate at the outer peripheral portion of the plate-shaped workpiece, thereby fixing the plate-shaped workpiece onto the support plate; and a processing step of processing the plate-shaped workpiece after the joining step. | ||
| 地址 | Tokyo JP | ||