Bonding head

摘要

A bonding head 6 is provided with a tool base 8 in a housing 6A and a laser for transmitting laser beam L is configured such that the laser beam L transmitted through this tool base 8 can heat an electronic component 3 and bond the same to a substrate 2. A surface of a heat-radiating member 15 is provided in contact with a surface of the tool base 8 on which the laser beam L impinges. This heat-radiating member 15 has a light transmittance for transmitting the laser beam L and also has a thermal conductivity higher than the thermal conductivity of the tool base 8. The tool base 8 is heated during bonding treatment, but heat transmitted to the tool base 8 rapidly escapes to the heat-radiating member 15 having a higher thermal conductivity.

主权项

1. A bonding head comprising a tool base disposed at a lower portion of a housing and, a laser for transmitting a laser beam to heat an electronic component and bond the electronic component to a substrate, a heat-radiating member provided in contact with a surface of the tool base on which the laser beam impinges and having a light transmittance for transmitting the laser beam and a thermal conductivity greater than a thermal conductivity of the tool base and a cooling member having a thermal conductivity greater than the thermal conductivity of the heat-radiating member is provided in contact with the heat-radiating member and arranged at a periphery of the heat-radiating member so that the laser beam passes through a center part of the heat-radiating member.