发明名称 Substrate treating apparatus and method of treating substrate
摘要 A substrate treating apparatus includes a rotating and holding unit that rotates a substrate, a first supply source that supplies first pure water having a first temperature, a second supply source that supplies second pure water having a second temperature higher than the first temperature, a treatment solution supply unit that supplies a treatment solution to a central section of an upper surface of the substrate, a first supply unit that supplies a first liquid containing the first pure water to a central section of a lower surface of the substrate, a second supply unit that supplies a second liquid containing the second pure water to a peripheral section and an intermediate section of the lower surface, and a heat amount control unit that independently controls an amount of heat to be supplied by the first supply unit and an amount of heat to be supplied by the second supply unit.
申请公布号 US9460944(B2) 申请公布日期 2016.10.04
申请号 US201514746950 申请日期 2015.06.23
申请人 SCREEN Holdings Co., Ltd. 发明人 Fujiwara Naozumi;Edo Toru;Sawashima Jun;Shimomura Tatsumi
分类号 H01L21/67;H01L21/02;H01L21/324;H01L21/66 主分类号 H01L21/67
代理机构 Ostrolenk Faber LLP 代理人 Ostrolenk Faber LLP
主权项 1. A substrate treating apparatus, comprising: a rotating and holding unit that rotates a substrate while horizontally holding the substrate; a first supply source that supplies first pure water having a first temperature; a second supply source that supplies second pure water having a second temperature higher than the first temperature; a pipe system that guides said first pure water by dividing said first pure water into one first pure water and the other first pure water; a treatment solution supply unit that is supplied with said one first pure water from said pipe system and supplies a treatment solution to a central section of an upper surface of said substrate, said treatment solution containing said one first pure water and a chemical solution mixed so as to mainly contain said one first pure water; a first supply unit that is supplied with said other first pure water from said pipe system and supplies a first liquid mainly containing said other first pure water to a central section of a lower surface of said substrate; a second supply unit that supplies a second liquid mainly containing said second pure water supplied from said second supply source to a peripheral section of the lower surface of said substrate and to an intermediate section of the lower surface between said peripheral section and said central section; and a heat amount control unit that independently controls an amount of heat to be supplied to said substrate by said first supply unit and an amount of heat to be supplied to said substrate by said second supply unit such that a temperature distribution in a radial direction of said substrate is changeable.
地址 Kyoto JP