发明名称 |
Nanoparticle filled underfill |
摘要 |
The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.
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申请公布号 |
US2003218258(A1) |
申请公布日期 |
2003.11.27 |
申请号 |
US20030441879 |
申请日期 |
2003.05.20 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
CHARLES SCOTT B.;GROSS KATHLEEN M.;HACKETT STEVEN C.;KROPP MICHAEL A.;SCHULTZ WILLIAM J.;THOMPSON WENDY L. |
分类号 |
C09C1/28;C09C3/12;C09J11/00;C09J11/04;C09J163/00;H01L21/56;H01L21/60;H01L23/29;H01L23/31;H05K3/30;(IPC1-7):H01L21/44 |
主分类号 |
C09C1/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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