Method and apparatus for cutting a substrate

摘要

A rotary cutting apparatus is configured to rotate about a first longitudinal axis. The cutting roll includes a cutting member. The apparatus includes an anvil roll that is configured to rotate about a second longitudinal axis. The anvil roll is positioned relative to the cutting roll such that the first longitudinal axis is substantially parallel with the second longitudinal axis. The anvil roll includes an outer circumferential surface. The second longitudinal axis is selectively movable between a first position and a second position relative to the first longitudinal axis. In the first position, a first minimum distance is defined between the first longitudinal axis and the second longitudinal axis. In the second position, a second minimum distance is defined between the first longitudinal axis and the second longitudinal axis, and wherein the second minimum distance is greater than the first minimum distance.

主权项

1. A method comprising the steps of:
advancing a substrate in a machine direction to a rotary cutting apparatus, the rotary cutting apparatus comprising a cutting roll and an anvil roll; rotating the cutting roll about a first longitudinal axis; rotating the anvil roll about a second longitudinal axis adjacent to the cutting roll, wherein the anvil roll is positioned relative to the cutting roll such that the first longitudinal axis is substantially parallel with the second longitudinal axis; placing the rotary cutting apparatus in a first configuration by moving the second longitudinal axis to a first position, wherein the substrate advances to the rotary cutting device in the first configuration at a second speed; applying vacuum pressure to the substrate such that the substrate is held against an outer circumferential surface of the cutting roll; cutting the substrate to form discrete components with the rotary cutting apparatus in the first configuration; holding the discrete components in an extended configuration on the outer circumferential surface of the cutting roll; placing the rotary cutting apparatus in a second configuration by moving the second longitudinal axis to a second position; and advancing the substrate at a first speed through the rotary cutting apparatus in the second configuration without cutting the substrate, wherein the second speed is greater than the first speed.