Hybrid PCB with multi-unreinforced laminate

摘要

A hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.

主权项

1. A hybrid printed circuit board comprising:
a top layer; a bottom layer; a plurality of internal layers stacked up between the top layer and the bottom layer, the plurality of internal layers including a first internal layer below the top layer and a second internal layer above the bottom layer; first unreinforced laminate placed between the top layer and the first internal layer; second unreinforced laminate placed between the second internal layer and the bottom layer; third laminate placed between adjacent internal layers of the plurality of internal layers; and traces on at least one of a top side or a bottom side of the hybrid printed circuit board, wherein the traces each have a width less than 75 micrometers.