发明名称 |
MULTILAYER PRINTED INTERCONNECTION BOARD AND MANUFACTURE OF THE SAME |
摘要 |
A multilayer printed wiring board produced by buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) through a first insulation laminate (12), and a second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern through through-studs (15) and a second insulation laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by buildup process a conductive paste on the roughened surface. |
申请公布号 |
JPS63170994(A) |
申请公布日期 |
1988.07.14 |
申请号 |
JP19870127176 |
申请日期 |
1987.05.26 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
SHIRAHATA ISAO;SHIGA SHOJI;HORI HISAKO |
分类号 |
H05K1/03;H05K1/05;H05K1/09;H05K3/24;H05K3/38;H05K3/40;H05K3/46 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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