| 摘要 |
<p>Essentially isotropic metallizable polymeric substrates having very low coefficients of thermal expansion are well adopted for printed circuits, are facilely prepared by papermaking technique and hot pressing, and are comprised of a fibrous polymer matrix, advantageously an aramide non-woven batt, bonded together with a cured imido prepolymer, and include particulate filler material, advantageously electrically insulating metal oxide particles, distributed therethrough.</p> |
